Thermal Compound
KennTherm 9231
KennTherm 9231 Thermal Compound is a non-silicone grease with low thermal impedance and long-term stability., the Specially formulated thermal compound with low viscosity and good consistency can be spread easily and evenly.
It can apply to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.
Features
- Non-Silicone Based
- No-metal compound
- No migration
- Safe to use
- Low dry-out
- Low thermal impedance
- Easy to apply
- Easy to clean-up
Specification
|
Properties |
Test Methods |
Units |
Typical value |
|
Color |
|
|
White |
|
Consistency |
ASTM D217 |
|
400 |
|
Specific Gravity |
ASTM D1475 |
g/cm3 |
2.5 |
|
Viscosity |
BrookField CVE #7 @12RPM |
Cps |
170000
|
|
Thermal Properties |
|
|
|
|
Thermal Conductivity |
ASTM D5470 |
W/m-K |
1.25 |
|
Thermal Impedance |
ASTM D 5470 |
K-in2/W |
0.036 |
|
Dry Out Test |
240 hours at 363K |
Weight% |
<0.01 |
|
Electrical Properties |
|
|
|
|
Dielectric constant |
298K@1000 Hz |
ASTM D-150 |
|
0.90 |
|
298K@100K Hz |
ASTM D-150 |
0.60 |
|
Dissipation factor |
298K@1000 Hz |
ASTM D-150 |
|
0.23 |
|
298K@100K Hz |
ASTM D-150 |
0.26 |
|
Dielectric Strength |
ASTM D-149 |
kV/mm |
4.8 |
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